KP

Kostas I. Papthomas

ET Endicott Interconnect Technologies: 2 patents #35 of 87Top 45%
Overall (All Time): #2,075,816 of 4,157,543Top 50%
2
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
8499440 Method of making halogen-free circuitized substrate with reduced thermal expansion Robert M. Japp, Voya R. Markovich 2013-08-06
7687722 Halogen-free circuitized substrate with reduced thermal expansion, method of making same, multilayered substrate structure utilizing same, and information handling system utilizing same Robert M. Japp, Voya R. Markovich 2010-03-30