Issued Patents All Time
Showing 26–50 of 59 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6194024 | Via fill compositions for direct attach of devices and methods for applying same | Roy Lynn Arldt, Christina M. Boyko, Burtran Joe Cayson, Richard Michael Kozlowski, Joseph Duane Kulesza +7 more | 2001-02-27 |
| 6178093 | Information handling system with circuit assembly having holes filled with filler material | Anilkumar C. Bhatt, Donald Herman Glatzel, Allen F. Moring, Voya R. Markovich, David J. Russell | 2001-01-23 |
| 6138350 | Process for manufacturing a circuit board with filled holes | Anilkumar C. Bhatt, Donald Herman Glatzel, Allen F. Moring, Voya R. Markovich, David J. Russell | 2000-10-31 |
| 6134772 | Via fill compositions for direct attach of devices and methods of applying same | Roy Lynn Arldt, Christina M. Boyko, Burtran Joe Cayson, Richard Michael Kozlowski, Joseph Duane Kulesza +7 more | 2000-10-24 |
| 6127025 | Circuit board with wiring sealing filled holes | Anilkumar C. Bhatt, Donald Herman Glatzel, Allen F. Moring, Voya R. Markovich, David J. Russell | 2000-10-03 |
| 6125531 | Method of making a printed circuit board having filled holes and a fill member for use therewith including reinforcement means | Donald S. Farquhar, Voya R. Markovich, Leonard L. Schmidt | 2000-10-03 |
| 6127097 | Photoresist develop and strip solvent compositions and method for their use | Nageshwer Rao Bantu, Anilkumar C. Bhatt, Ashwinkumar C. Bhatt, Joseph Alphonse Kotylo, Gerald W. Jones +2 more | 2000-10-03 |
| 6114098 | Method of filling an aperture in a substrate | Bernd Karl Appelt, John S. Kresge, John M. Lauffer | 2000-09-05 |
| 6114019 | Circuit board assemblies having filled vias free from bleed-out | Anilkumar C. Bhatt, Donald Herman Glatzel, Allen F. Moring, Voya R. Markovich, David J. Russell | 2000-09-05 |
| 6106891 | Via fill compositions for direct attach of devices and method for applying same | Joseph Duane Kulesza, Voya R. Markovich, Joseph Gene Sabia | 2000-08-22 |
| 6087021 | Polymer with transient liquid phase bondable particles | Michael A. Gaynes, Giana M. Phelan, Charles G. Woychik | 2000-07-11 |
| 6079100 | Method of making a printed circuit board having filled holes and fill member for use therewith | Donald S. Farquhar, Voya R. Markovich, Leonard L. Schmidt | 2000-06-27 |
| 6066889 | Methods of selectively filling apertures | Gerald W. Jones, Heike Marcello | 2000-05-23 |
| 6000129 | Process for manufacturing a circuit with filled holes | Anilkumar C. Bhatt, Donald Herman Glatzel, Allen F. Moring, Voya R. Markovich, David J. Russell | 1999-12-14 |
| 5887345 | Method for applying curable fill compositon to apertures in a substrate | Joseph Duane Kulesza, Voya R. Markovich, Joseph Gene Sabia | 1999-03-30 |
| 5863332 | Fluid jet impregnating and coating device with thickness control capability | Elizabeth Foster, Jeffrey Hedrick, Robert M. Japp, Stephen L. Tisdale, Alfred Viehbeck | 1999-01-26 |
| 5822856 | Manufacturing circuit board assemblies having filled vias | Anilkumar C. Bhatt, Donald Herman Glatzel, Allen F. Moring, Voya R. Markovich, David J. Russell | 1998-10-20 |
| 5766670 | Via fill compositions for direct attach of devices and methods for applying same | Roy Lynn Arldt, Christina M. Boyko, Burtran Joe Cayson, Richard Michael Kozlowski, Joseph Duane Kulesza +7 more | 1998-06-16 |
| 5713508 | Stabilization of conductive adhesive by metallurgical bonding | Michael A. Gaynes, Giana M. Phelan, Charles G. Woychik | 1998-02-03 |
| 5668059 | Solder interconnection structure and process for making | Frederick R. Christie, David W. Wang | 1997-09-16 |
| 5656862 | Solder interconnection structure | David W. Wang | 1997-08-12 |
| 5637442 | Method for treating photolithographic developer and stripper waste streams containing resist or solder mask and gamma butyrolactone or benzyl alcohol | Anilkumar C. Bhatt, Gary S. Ksenak, James A. Shurtleff, Jerome J. Wagner | 1997-06-10 |
| 5571417 | Method for treating photolithographic developer and stripper waste streams containing resist or solder mask and gamma butyrolactone or benzyl alcohol | Anilkumar C. Bhatt, Gary S. Ksenak, James A. Shurtleff, Jerome J. Wagner | 1996-11-05 |
| 5571593 | Via fill compositions for direct attach of devices and methods for applying same | Roy Lynn Arldt, Christina M. Boyko, Burtran Joe Cayson, Richard Michael Kozlowski, Joseph Duane Kulesza +7 more | 1996-11-05 |
| 5542602 | Stabilization of conductive adhesive by metallurgical bonding | Michael A. Gaynes, Giana M. Phelan, Charles G. Woychik | 1996-08-06 |