Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6194024 | Via fill compositions for direct attach of devices and methods for applying same | Roy Lynn Arldt, Christina M. Boyko, Burtran Joe Cayson, Richard Michael Kozlowski, Joseph Duane Kulesza +7 more | 2001-02-27 |
| 6134772 | Via fill compositions for direct attach of devices and methods of applying same | Roy Lynn Arldt, Christina M. Boyko, Burtran Joe Cayson, Richard Michael Kozlowski, Joseph Duane Kulesza +7 more | 2000-10-24 |
| 6106891 | Via fill compositions for direct attach of devices and method for applying same | Joseph Duane Kulesza, Voya R. Markovich, Kostas Papathomas | 2000-08-22 |
| 5887345 | Method for applying curable fill compositon to apertures in a substrate | Joseph Duane Kulesza, Voya R. Markovich, Kostas Papathomas | 1999-03-30 |
| 5766670 | Via fill compositions for direct attach of devices and methods for applying same | Roy Lynn Arldt, Christina M. Boyko, Burtran Joe Cayson, Richard Michael Kozlowski, Joseph Duane Kulesza +7 more | 1998-06-16 |
| 5571593 | Via fill compositions for direct attach of devices and methods for applying same | Roy Lynn Arldt, Christina M. Boyko, Burtran Joe Cayson, Richard Michael Kozlowski, Joseph Duane Kulesza +7 more | 1996-11-05 |
| 5450290 | Printed circuit board with aligned connections and method of making same | Christina M. Boyko, Francis J. Bucek, Richard W. Carpenter, Voya R. Markovich, Darleen Mayo +1 more | 1995-09-12 |