Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Low moisture absorptive circuitized substrate, method of making same, electrical assembly utilizing same, and information handling system utilizing same

Low moisture absorptive circuitized substrate, method of making same, electrical assembly utilizing same, and information handling system utilizing same

US Patent 7145221 · Granted Dec 5, 2006

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method of making a circuitized substrate2017
Circuitized substrate with dielectric layer having dielectric composition not in2013
Multilayered circuitized substrate with P-aramid dielectric layers and method of2012
Power core for use in circuitized substrate and method of making same2012
Multi-layer embedded capacitance and resistance substrate core2012
Circuitized substrate with continuous thermoplastic support film dielectric laye2011
Circuitized substrate with conductive paste, electrical assembly including said 2011
Dielectric composition for use in circuitized substrates and circuitized substra2011
High performance chip carrier substrate2011
High performance chip carrier substrate2011
Multi-layer embedded capacitance and resistance substrate core2010
Multilayered circuitized substrate with p-aramid dielectric layers and method of2010