Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Multi-layer embedded capacitance and resistance substrate core

Multi-layer embedded capacitance and resistance substrate core

US Patent 8144480 · Granted Mar 27, 2012

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Superconducting integrated circuit2020
Cryogenic electronic packages and assemblies2020
Semiconductor structures for assembly in multi-layer semiconductor devices inclu2019
Interconnect structures for assembly of semiconductor structures including super2019
Cryogenic electronic packages and methods for fabricating cryogenic electronic p2019
Interconnect structure and semiconductor structures for assembly of cryogenic el2019
Multi-layer semiconductor structure and methods for fabricating multi-layer semi2019
Shielded through via structures and methods for fabricating shielded through via2019
Qubit and coupler circuit structures and coupling techniques2018
Interconnect structures and methods for fabricating interconnect structures2018
Interconnect structures for assembly of semiconductor structures including at le2018
Multi-layer semiconductor devices fabricated using a combination of substrate an2018