MR

Michael Rowlands

MO Molex: 12 patents #134 of 1,726Top 8%
AM Amphenol: 3 patents #112 of 392Top 30%
ET Endicott Interconnect Technologies: 2 patents #35 of 87Top 45%
Overall (All Time): #243,983 of 4,157,543Top 6%
18
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12212100 Miniaturized high speed connector Arkady Y. Zerebilov, Theron Ensminger, Jeremy Shober 2025-01-28
12150240 Bend compensation for conductive traces on printed circuit boards Ali Hammoodi 2024-11-19
11665814 Bend compensation for conductive traces on printed circuit boards Ali Hammoodi 2023-05-30
10566719 Connector for mounting on a circuit board Kirk B. Peloza, Kent E. Regnier 2020-02-18
10230192 Electrical connector Kirk B. Peloza, Daniel Tillotson, Eric Scharping, Jeanine Madison, Adam Stanczak 2019-03-12
10230186 Connector with dual card slots Steven B. Bogiel 2019-03-12
10084257 Electrical connector Kirk B. Peloza, Daniel Tillotson, Eric Scharping, Jeanine Madison, Adam Stanczak 2018-09-25
9923292 Connector having a housing with closed loop terminals Kirk B. Peloza, Kent E. Regnier 2018-03-20
9882314 Differentially coupled connector Patrick R. Casher, Jerry D. Kachlic, Kent E. Regnier 2018-01-30
9660383 Connector with tuned terminal beam Kent E. Regnier 2017-05-23
9525245 High density connector Kent E. Regnier, Patrick R. Casher 2016-12-20
9515421 Differentially coupled connector Patrick R. Casher, Jerry D. Kachlic, Kent E. Regnier 2016-12-06
9420689 Method of making a circuitized substrate Rabindra N. Das 2016-08-16
9385455 High density connector Kent E. Regnier, Patrick R. Casher 2016-07-05
9246251 High density connector Kent E. Regnier, Patrick R. Casher 2016-01-26
9083130 Differentially coupled connector Patrick R. Casher, Jerry D. Kachlic, Kent E. Regnier 2015-07-14
8143530 Liquid crystal polymer layer for encapsulation and improved hermiticity of circuitized substrates Rabindra N. Das 2012-03-27
7687724 Circuitized substrate with internal resistor, method of making said circuitized substrate, and electrical assembly utilizing said circuitized substrate Rabindra N. Das 2010-03-30