Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12212100 | Miniaturized high speed connector | Arkady Y. Zerebilov, Theron Ensminger, Jeremy Shober | 2025-01-28 |
| 12150240 | Bend compensation for conductive traces on printed circuit boards | Ali Hammoodi | 2024-11-19 |
| 11665814 | Bend compensation for conductive traces on printed circuit boards | Ali Hammoodi | 2023-05-30 |
| 10566719 | Connector for mounting on a circuit board | Kirk B. Peloza, Kent E. Regnier | 2020-02-18 |
| 10230192 | Electrical connector | Kirk B. Peloza, Daniel Tillotson, Eric Scharping, Jeanine Madison, Adam Stanczak | 2019-03-12 |
| 10230186 | Connector with dual card slots | Steven B. Bogiel | 2019-03-12 |
| 10084257 | Electrical connector | Kirk B. Peloza, Daniel Tillotson, Eric Scharping, Jeanine Madison, Adam Stanczak | 2018-09-25 |
| 9923292 | Connector having a housing with closed loop terminals | Kirk B. Peloza, Kent E. Regnier | 2018-03-20 |
| 9882314 | Differentially coupled connector | Patrick R. Casher, Jerry D. Kachlic, Kent E. Regnier | 2018-01-30 |
| 9660383 | Connector with tuned terminal beam | Kent E. Regnier | 2017-05-23 |
| 9525245 | High density connector | Kent E. Regnier, Patrick R. Casher | 2016-12-20 |
| 9515421 | Differentially coupled connector | Patrick R. Casher, Jerry D. Kachlic, Kent E. Regnier | 2016-12-06 |
| 9420689 | Method of making a circuitized substrate | Rabindra N. Das | 2016-08-16 |
| 9385455 | High density connector | Kent E. Regnier, Patrick R. Casher | 2016-07-05 |
| 9246251 | High density connector | Kent E. Regnier, Patrick R. Casher | 2016-01-26 |
| 9083130 | Differentially coupled connector | Patrick R. Casher, Jerry D. Kachlic, Kent E. Regnier | 2015-07-14 |
| 8143530 | Liquid crystal polymer layer for encapsulation and improved hermiticity of circuitized substrates | Rabindra N. Das | 2012-03-27 |
| 7687724 | Circuitized substrate with internal resistor, method of making said circuitized substrate, and electrical assembly utilizing said circuitized substrate | Rabindra N. Das | 2010-03-30 |