Issued Patents All Time
Showing 26–30 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6104093 | Thermally enhanced and mechanically balanced flip chip package and method of forming | Jean Dery, Eric Duchesne, Michael A. Gaynes, Eric A. Johnson, Luis J. Matienzo +1 more | 2000-08-15 |
| 6051982 | Electronic component test apparatus with rotational probe and conductive spaced apart means | David J. Alcoe | 2000-04-18 |
| 5947750 | Elastomeric structure with multi-layered elastomer and constraining base | David J. Alcoe, William L. Brodsky | 1999-09-07 |
| 5873740 | Electrical connector system with member having layers of different durometer elastomeric materials | David J. Alcoe, William L. Brodsky | 1999-02-23 |
| 5804984 | Electronic component test apparatus with rotational probe | David J. Alcoe | 1998-09-08 |