Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for producing a reliable BGA solder joint interconnection

Method for producing a reliable BGA solder joint interconnection

US Patent 6138893 · Granted Oct 31, 2000

Estimated economic value: $31,312,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Integrated interposer solutions for 2D and 3D IC packaging2022
Integrated circuits protected by substrates with cavities, and methods of manufa2021
Embedded graphite heat spreader for 3DIC2020
Microelectronic components with features wrapping around protrusions of conducti2019
Method and structures for heat dissipating interposers2019
Integrated circuits protected by substrates with cavities, and methods of manufa2019
Interposers with electrically conductive features having different porosities2019
Method of fabricating low CTE interposer without TSV structure2019
Structure and method for integrated circuits packaging with increased density2019
Hybrid 3D/2.5D interposer2019
BVA interposer2019
Integrated interposer solutions for 2D and 3D IC packaging2019