Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates

Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates

US Patent 10522457 · Granted Dec 31, 2019

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Expansion controlled structure for direct bonding and method of forming same2025
Triazatricycle compounds for the treatment of autoimmune disease2025
Method for etching of metal2025
Directly bonded metal structures having aluminum features and methods of prepari2025
Metal pads over TSV2025
Structures with through-substrate vias and methods for forming the same2025
Bonded structure including an obstructive element directly bonded to a semicondu2025
Die processing2025
Direct bonding methods and structures2025
Mitigating surface damage of probe pads in preparation for direct bonding of a s2025
Post CMP processing for hybrid bonding2025
Techniques for processing devices2025