Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6603195 | Planarized plastic package modules for integrated circuits | David V. Caletka, John P. Cincotta, Kibby B. Horsford, Gary H. Irish, John J. Lajza, Jr. +4 more | 2003-08-05 |
| 5776801 | Leadframe having contact pads defined by a polymer insulating film | Gary H. Irish, Sheldon C. Rieley, Robert M. Smith, Robert Jackson | 1998-07-07 |
| 5608260 | Leadframe having contact pads defined by a polymer insulating film | Gary H. Irish, Sheldon C. Rieley, Robert M. Smith, Robert Jackson | 1997-03-04 |