| 6002164 |
Semiconductor lead frame |
H. Ward Conru |
1999-12-14 |
| 5776790 |
C4 Pb/Sn evaporation process |
John C. Kutt, Robert Henry Zalokar, Jr. |
1998-07-07 |
| 5576246 |
Personalized area leadframe coining or half etching for reduced mechanical stress at device edge |
Harold W. Conru, Francis E. Froebel, Albert J. Gregoritsch, Jr., Sheldon C. Rieley, Ronald R. Uttecht +2 more |
1996-11-19 |
| 5545921 |
Personalized area leadframe coining or half etching for reduced mechanical stress at device edge |
Harold W. Conru, Francis E. Froebel, Albert J. Gregoritsch, Jr., Sheldon C. Rieley, Ronald R. Uttecht +2 more |
1996-08-13 |
| 5151559 |
Planarized thin film surface covered wire bonded semiconductor package |
H. Ward Conru, Gary H. Irish, Francis J. Pakulski, William J. Slattery, William Ward |
1992-09-29 |
| 5086018 |
Method of making a planarized thin film covered wire bonded semiconductor package |
H. Ward Conru, Gary H. Irish, Francis J. Pakulski, William J. Slattery, William Ward |
1992-02-04 |
| 4965654 |
Semiconductor package with ground plane |
Friedrich A. Karner, Douglas W. Phelps, Jr., William Ward |
1990-10-23 |
| 4907734 |
Method of bonding gold or gold alloy wire to lead tin solder |
H. Ward Conru, Stephen E. Gons, Gordon C. Osborne, Jr., Douglas W. Phelps, Jr., William Ward |
1990-03-13 |
