Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6043557 | Tape application platform and processes therefor | Edward John Dombroski, William Ward | 2000-03-28 |
| 5889320 | Tape application platform and processes therefor | Edward John Dombroski, William Ward | 1999-03-30 |
| 5696032 | Tape application platform and processes therefor | Edward John Dombroski, William Ward | 1997-12-09 |
| 5661336 | Tape application platform and processes therefor | Edward John Dombroski, William Ward | 1997-08-26 |
| 4965654 | Semiconductor package with ground plane | Friedrich A. Karner, Stephen G. Starr, William Ward | 1990-10-23 |
| 4907734 | Method of bonding gold or gold alloy wire to lead tin solder | H. Ward Conru, Stephen E. Gons, Gordon C. Osborne, Jr., Stephen G. Starr, William Ward | 1990-03-13 |
| 4878108 | Heat dissipation package for integrated circuits | William Ward | 1989-10-31 |
| 4862245 | Package semiconductor chip | Richard P. Pashby, Sigvart J. Samuelsen, William Ward | 1989-08-29 |
| 4821945 | Single lead automatic clamping and bonding system | Judith A. Chase, Robert J. Redmond, Stephen Garrett Starr, II | 1989-04-18 |
| 4796078 | Peripheral/area wire bonding technique | Robert J. Redmond, William Ward | 1989-01-03 |
| 4714953 | Welded wire cooling | Marvin L. Buller, Douglas L. Lumbra, Sigvart J. Samuelsen, William Ward | 1987-12-22 |
| 4551912 | Highly integrated universal tape bonding | Robert Marks, Sigvart J. Samuelsen, William Ward | 1985-11-12 |
| 4447857 | Substrate with multiple type connections | Robert Marks, William Ward | 1984-05-08 |
| 4417120 | Percussive arc welding | Douglas L. Lumbra, Sigvart J. Samuelsen, William Ward | 1983-11-22 |