FP

Francis J. Pakulski

IBM: 3 patents #26,272 of 70,183Top 40%
📍 Shelburne, VT: #46 of 140 inventorsTop 35%
🗺 Vermont: #1,707 of 4,968 inventorsTop 35%
Overall (All Time): #1,660,176 of 4,157,543Top 40%
3
Patents All Time

Issued Patents All Time

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
5151559 Planarized thin film surface covered wire bonded semiconductor package H. Ward Conru, Gary H. Irish, William J. Slattery, Stephen G. Starr, William Ward 1992-09-29
5086018 Method of making a planarized thin film covered wire bonded semiconductor package H. Ward Conru, Gary H. Irish, William J. Slattery, Stephen G. Starr, William Ward 1992-02-04
4633440 Multi-port memory chip in a hierarchical memory 1986-12-30