Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 5318803 | Conditioning of a substrate for electroless plating thereon | Harry R. Bickford, Dennis A. Canfield, Stephen L. Tisdale, Alfred Viehbeck | 1994-06-07 | $8,003,000 |
| 4714646 | Electrophoretic insulation of metal circuit board core | David L. Fletcher | 1987-12-22 | $29,248,000 |
| 4421429 | Resistive substrate for thermal printing ribbons comprising a mixture of thermosetting polyimide, thermoplastic polyimide, and conductive particulate material | — | 1983-12-20 | $18,786,000 |
| 4419024 | Silicon dioxide intermediate layer in thermal transfer medium | Patsy A. Bowlds, Bruce M. Cassidy, Robert J. Huljak, Donald Wayne Stafford, Deh C. Tao | 1983-12-06 | $23,661,000 |