FW

Francis R. White

IBM: 26 patents #4,008 of 70,183Top 6%
📍 South Burlington, VT: #87 of 1,136 inventorsTop 8%
🗺 Vermont: #282 of 4,968 inventorsTop 6%
Overall (All Time): #155,824 of 4,157,543Top 4%
26
Patents All Time

Issued Patents All Time

Showing 1–25 of 26 patents

Patent #TitleCo-InventorsDate
8298906 Trench decoupling capacitor formed by RIE lag of through silicon via (TSV) etch Kerry Bernstein 2012-10-30
8133772 Deep trench capacitor for SOI CMOS devices for soft error immunity John E. Barth, Jr., Kerry Bernstein, Ethan H. Cannon 2012-03-13
8053303 SOI body contact using E-DRAM technology John E. Barth, Jr., Kerry Bernstein 2011-11-08
7989893 SOI body contact using E-DRAM technology John E. Barth, Jr., Kerry Bernstein 2011-08-02
7989865 Deep trench capacitor for SOI CMOS devices for soft error immunity John E. Barth, Jr., Kerry Bernstein, Ethan H. Cannon 2011-08-02
7812388 Deep trench capacitor and method of making same Timothy W. Kemerer, Robert M. Rassel, Steven M. Shank 2010-10-12
7694262 Deep trench capacitor and method of making same Timothy W. Kemerer, Robert M. Rassel, Steven M. Shank 2010-04-06
6680259 Dual layer etch stop barrier Chung H. Lam, Eric Lee 2004-01-20
6548418 Dual layer etch stop barrier Chung H. Lam, Eric Lee 2003-04-15
6420777 Dual layer etch stop barrier Chung H. Lam, Eric Lee 2002-07-16
6335272 Buried butted contact and method for fabricating Archibald J. Allen, Jerome B. Lasky, Randy W. Mann, Jed H. Rankin 2002-01-01
6174763 Three-dimensional SRAM trench structure and fabrication method therefor Kenneth E. Beilstein, Jr., Claude L. Bertin, John Cronin 2001-01-16
6153934 Buried butted contact and method for fabricating Archibald J. Allen, Jerome B. Lasky, Randy W. Mann, Jed H. Rankin 2000-11-28
6140171 FET device containing a conducting sidewall spacer for local interconnect and method for its fabrication Archibald J. Allen, Jerome B. Lasky, Randy W. Mann, John J. Pekarik, Jed H. Rankin +1 more 2000-10-31
6038168 Hot-electron programmable latch for integrated circuit fuse applications and method of programming therefor Archibald J. Allen, Jerome B. Lasky, John J. Pekarik, Jed H. Rankin 2000-03-14
6022766 Semiconductor structure incorporating thin film transistors, and methods for its manufacture Bomy Chen, Subhash B. Kulkarni, Jerome B. Lasky, Randy W. Mann, Edward J. Nowak +1 more 2000-02-08
5675185 Semiconductor structure incorporating thin film transistors with undoped cap oxide layers Bomy Chen, Subhash B. Kulkarni, Jerome B. Lasky, Randy W. Mann, Edward J. Nowak +1 more 1997-10-07
5670803 Three-dimensional SRAM trench structure and fabrication method therefor Kenneth E. Beilstein, Jr., Claude L. Bertin, John Cronin 1997-09-23
5270261 Three dimensional multichip package methods of fabrication Claude L. Bertin, Paul A. Farrar, Howard L. Kalter, Gordon A. Kelley, Jr., Willem B. van der Hoeven 1993-12-14
5202754 Three-dimensional multichip packages and methods of fabrication Claude L. Bertin, Paul A. Farrar, Howard L. Kalter, Gordon A. Kelley, Jr., Willem B. van der Hoeven 1993-04-13
5096849 Process for positioning a mask within a concave semiconductor structure Kenneth E. Beilstein, Jr., Claude L. Bertin 1992-03-17
5055898 DRAM memory cell having a horizontal SOI transfer device disposed over a buried storage node and fabrication methods therefor Kenneth E. Beilstein, Jr., Claude L. Bertin, John R. Pessetto 1991-10-08
4799990 Method of self-aligning a trench isolation structure to an implanted well region Michael L. Kerbaugh, Charles W. Koburger, III, Jerome B. Lasky, Paul C. Parries 1989-01-24
4558508 Process of making dual well CMOS semiconductor structure with aligned field-dopings using single masking step Wayne Kinney, Charles W. Koburger, III, Jerome B. Lasky, Larry A. Nesbit, Ronald R. Troutman 1985-12-17
4527325 Process for fabricating semiconductor devices utilizing a protective film during high temperature annealing Henry J. Geipel, Jr., Charles A. Schaefer, John M. Wursthorn 1985-07-09