| 8489936 |
High reliability memory module with a fault tolerant address and command bus |
Kevin C. Gower, Bruce G. Hazelzet, Mark W. Kellogg |
2013-07-16 |
| 7761771 |
High reliability memory module with a fault tolerant address and command bus |
Kevin C. Gower, Bruce G. Hazelzet, Mark W. Kellogg |
2010-07-20 |
| 7363533 |
High reliability memory module with a fault tolerant address and command bus |
Kevin C. Gower, Bruce G. Hazelzet, Mark W. Kellogg |
2008-04-22 |
| 7234099 |
High reliability memory module with a fault tolerant address and command bus |
Kevin C. Gower, Bruce G. Hazelzet, Mark W. Kellogg |
2007-06-19 |
| 5923181 |
Methods and apparatus for burn-in stressing and simultaneous testing of semiconductor device chips in a multichip module |
Kenneth E. Beilstein, Jr., Claude L. Bertin, Dennis Charles Dubois, Wayne J. Howell, Gordon A. Kelley, Jr. +4 more |
1999-07-13 |
| 5786628 |
Method and workpiece for connecting a thin layer to a monolithic electronic modules surface and associated module packaging |
Kenneth E. Beilstein, Jr., Claude L. Bertin, John Cronin, Wayne J. Howell, James M. Leas |
1998-07-28 |
| 5719438 |
Method and workpiece for connecting a thin layer to a monolithic electronic module's surface and associated module packaging |
Kenneth E. Beilstein, Jr., Claude L. Bertin, John Cronin, Wayne J. Howell, James M. Leas |
1998-02-17 |
| 5712190 |
Process for controlling distance between integrated circuit chips in an electronic module |
Claude L. Bertin, John Cronin |
1998-01-27 |
| 5686843 |
Methods and apparatus for burn-in stressing and simultaneous testing of semiconductor device chips in a multichip module |
Kenneth E. Beilstein, Jr., Claude L. Bertin, Dennis Charles Dubois, Wayne J. Howell, Gordon A. Kelley, Jr. +4 more |
1997-11-11 |
| 5567653 |
Process for aligning etch masks on an integrated circuit surface using electromagnetic energy |
Claude L. Bertin, John Cronin |
1996-10-22 |
| 5567654 |
Method and workpiece for connecting a thin layer to a monolithic electronic module's surface and associated module packaging |
Kenneth E. Beilstein, Jr., Claude L. Bertin, John Cronin, Wayne J. Howell, James M. Leas |
1996-10-22 |
| 5532519 |
Cube wireability enhancement with chip-to-chip alignment and thickness control |
Claude L. Bertin, John Cronin |
1996-07-02 |
| 5478781 |
Polyimide-insulated cube package of stacked semiconductor device chips |
Claude L. Bertin, Paul A. Farrar, Wayne J. Howell, Christopher P. Miller |
1995-12-26 |
| 5414637 |
Intra-module spare routing for high density electronic packages |
Claude L. Bertin, Christopher P. Miller |
1995-05-09 |
| 5297091 |
Early row address strobe (RAS) precharge |
Robert M. Blake, William Paul Hovis |
1994-03-22 |
| 5229639 |
Low powder distribution inductance lead frame for semiconductor chips |
Kenneth M. Hansen |
1993-07-20 |
| 4341942 |
Method of bonding wires to passivated chip microcircuit conductors |
Praveen Chaudhari, John B. Kiessling, Eugene E. Tynan, Robert J. von Gutfeld |
1982-07-27 |
| 4196389 |
Test site for a charged coupled device (CCD) array |
Helen J. Kelly, Akella V. S. Satya |
1980-04-01 |
