| 7405139 |
Prevention of backside cracks in semiconductor chips or wafers using backside film or backside wet etch |
Jeffrey P. Gambino, Jerome B. Lasky, Christopher D. Muzzy, Wolfgang Sauter |
2008-07-29 |
| 7348210 |
Post bump passivation for soft error protection |
Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter, Edmund J. Sprogis |
2008-03-25 |
| 7335577 |
Crack stop for low K dielectrics |
Jeffrey P. Gambino, Stephen E. Luce, Thomas L. McDevitt, William T. Motsiff, Mark J. Pouliot +1 more |
2008-02-26 |
| 7329951 |
Solder bumps in flip-chip technologies |
Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter |
2008-02-12 |
| 7323780 |
Electrical interconnection structure formation |
Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter |
2008-01-29 |
| 7316940 |
Chip dicing |
Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter |
2008-01-08 |
| 7316971 |
Wire bond pads |
Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter |
2008-01-08 |
| 7256503 |
Chip underfill in flip-chip technologies |
Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter, David L. Questad |
2007-08-14 |
| 7232695 |
Method and apparatus for completely covering a wafer with a passivating material |
Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter, Jeffrey S. Zimmerman |
2007-06-19 |
| 7176583 |
Damascene patterning of barrier layer metal for C4 solder bumps |
Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter |
2007-02-13 |
| 7112470 |
Chip dicing |
Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter |
2006-09-26 |
| 6991971 |
Method for fabricating a triple damascene fuse |
Thomas L. McDevitt, William T. Motsiff, Anthony K. Stamper |
2006-01-31 |
| 6946379 |
Insulative cap for laser fusing |
Thomas L. McDevitt, William T. Motsiff, Henry A. Nye, III |
2005-09-20 |
| 6924210 |
Chip dicing |
William T. Motsiff, Christopher D. Muzzy, Wolfgang Sauter |
2005-08-02 |
| 6835973 |
Antifuse for use with low &kgr; dielectric foam insulators |
William A. Klaasen, William T. Motsiff, Rosemary A. Previti-Kelly, Jed H. Rankin |
2004-12-28 |
| 6833720 |
Electrical detection of dicing damage |
Jeffrey P. Gambino, Thomas L. McDevitt, Anthony K. Stamper |
2004-12-21 |
| 6827868 |
Thinning of fuse passivation after C4 formation |
Jeffrey P. Gambino, William T. Motsiff |
2004-12-07 |
| 6815838 |
Laser alignment target and method |
Richard A. Gilmour, William T. Motsiff, Christopher D. Muzzy |
2004-11-09 |
| 6784516 |
Insulative cap for laser fusing |
Thomas L. McDevitt, William T. Motsiff, Henry A. Nye, III |
2004-08-31 |
| 6746947 |
Post-fuse blow corrosion prevention structure for copper fuses |
Daniel C. Edelstein, Robert M. Geffken, William T. Motsiff, Anthony K. Stamper, Steven H. Voldman |
2004-06-08 |
| 6734047 |
Thinning of fuse passivation after C4 formation |
Jeffrey P. Gambino, William T. Motsiff |
2004-05-11 |
| 6667533 |
Triple damascene fuse |
Thomas L. McDevitt, William T. Motsiff, Anthony K. Stamper |
2003-12-23 |
| 6498385 |
Post-fuse blow corrosion prevention structure for copper fuses |
Daniel C. Edelstein, Robert M. Geffken, William T. Motsiff, Anthony K. Stamper, Steven H. Voldman |
2002-12-24 |
| 6496053 |
Corrosion insensitive fusible link using capacitance sensing for semiconductor devices |
Kurt R. Kimmel, William A. Klaasen, William T. Motsiff, Rosemary A. Previti-Kelly, W David Pricer +1 more |
2002-12-17 |
| 6492207 |
Method for making a pedestal fuse |
Dennis P. Bouldin, William T. Motsiff |
2002-12-10 |
