Issued Patents All Time
Showing 76–100 of 167 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8299611 | Ball-limiting-metallurgy layers in solder ball structures | Charles L. Arvin, Wolfgang Sauter, Timothy D. Sullivan | 2012-10-30 |
| 8264078 | Metal wiring structures for uniform current density in C4 balls | Wolfgang Sauter, Timothy D. Sullivan, Steven L. Wright, Edmund J. Sprogis | 2012-09-11 |
| 8242012 | Integrated circuit structure incorporating a conductor layer with both top surface and sidewall passivation and a method of forming the integrated circuit structure | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2012-08-14 |
| 8236615 | Passivation layer surface topography modifications for improved integrity in packaged assemblies | Alexandre Blander, Jon A. Casey, Ian D. Melville, Jennifer V. Muncy, Marie-Claude Paquet | 2012-08-07 |
| 8237279 | Collar structure around solder balls that connect semiconductor die to semiconductor chip package substrate | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2012-08-07 |
| 8227333 | Ni plating of a BLM edge for Pb-free C4 undercut control | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2012-07-24 |
| 8212357 | Combination via and pad structure for improved solder bump electromigration characteristics | Jeffrey P. Gambino, Timothy D. Sullivan | 2012-07-03 |
| 8198133 | Structures and methods to improve lead-free C4 interconnect reliability | Paul F. Fortier, Jeffrey P. Gambino, Christopher D. Muzzy, David L. Questad, Wolfgang Sauter +1 more | 2012-06-12 |
| 8164188 | Methods of forming solder connections and structure thereof | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2012-04-24 |
| 8159067 | Underfill flow guide structures | Jeffrey P. Gambino, Christopher D. Muzzy, Marie-Claude Paquet, Wolfgang Sauter, Timothy D. Sullivan | 2012-04-17 |
| 8138602 | Solder interconnect pads with current spreading layers | Timothy D. Sullivan | 2012-03-20 |
| 8138099 | Chip package solder interconnect formed by surface tension | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2012-03-20 |
| 8114767 | Structure, semiconductor structure and method of manufacturing a semiconductor structure and packaging thereof | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter, Jeffrey S. Zimmerman | 2012-02-14 |
| 8084858 | Metal wiring structures for uniform current density in C4 balls | Wolfgang Sauter, Timothy D. Sullivan, Steven L. Wright, Edmund J. Sprogis | 2011-12-27 |
| 7989358 | Prevention of backside cracks in semiconductor chips or wafers using backside film or backside wet etch | Jeffrey P. Gambino, Jerome B. Lasky, Christopher D. Muzzy, Wolfgang Sauter | 2011-08-02 |
| 7985671 | Structures and methods for improving solder bump connections in semiconductor devices | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2011-07-26 |
| 7958477 | Structure, failure analysis tool and method of determining white bump location using failure analysis tool | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter, Jeffrey S. Zimmerman | 2011-06-07 |
| 7939390 | Gap capacitors for monitoring stress in solder balls in flip chip technology | Stephen P. Ayotte, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2011-05-10 |
| 7935408 | Substrate anchor structure and method | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2011-05-03 |
| 7911803 | Current distribution structure and method | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2011-03-22 |
| 7910408 | Damage propagation barrier and method of forming | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2011-03-22 |
| 7871920 | Semiconductor chips with reduced stress from underfill at edge of chip | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2011-01-18 |
| 7871919 | Structures and methods for improving solder bump connections in semiconductor devices | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2011-01-18 |
| 7868453 | Solder interconnect pads with current spreading layers | Timothy D. Sullivan | 2011-01-11 |
| 7863183 | Method for fabricating last level copper-to-C4 connection with interfacial cap structure | William Francis Landers, Donna S. Zupanski-Nielsen | 2011-01-04 |