Issued Patents All Time
Showing 26–50 of 167 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8937009 | Far back end of the line metallization method and structures | Jeffrey P. Gambino, Karen P. McLaughlin, Ekta Misra, Christopher D. Muzzy, Eric D. Perfecto +1 more | 2015-01-20 |
| 8933540 | Thermal via for 3D integrated circuits structures | Jeffrey P. Gambino, Michael J. Hauser, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2015-01-13 |
| 8927869 | Semiconductor structures and methods of manufacture | Jeffrey P. Gambino, Zhong-Xiang He, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2015-01-06 |
| 8927411 | System and method for forming an aluminum fuse for compatibility with copper BEOL interconnect scheme | Felix P. Anderson, Jeffrey P. Gambino, Timothy S. Hayes, Donald R. Letourneau, Thomas L. McDevitt +1 more | 2015-01-06 |
| 8927334 | Overcoming chip warping to enhance wetting of solder bumps and flip chip attaches in a flip chip package | Jeffrey P. Gambino, Christopher D. Muzzy, Nathalie Normand, David L. Questad, Wolfgang Sauter +1 more | 2015-01-06 |
| 8921975 | System and method for forming aluminum fuse for compatibility with copper BEOL interconnect scheme | Felix P. Anderson, Jeffrey P. Gambino, Timothy S. Hayes, Donald R. Letourneau, Thomas L. McDevitt +1 more | 2014-12-30 |
| 8916463 | Wire bond splash containment | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2014-12-23 |
| 8916464 | Structures and methods for improving solder bump connections in semiconductor devices | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2014-12-23 |
| 8896138 | Chip identification for organic laminate packaging and methods of manufacture | Albert J. Banach, Wolfgang Sauter | 2014-11-25 |
| 8835229 | Chip identification for organic laminate packaging and methods of manufacture | Albert J. Banach, Wolfgang Sauter | 2014-09-16 |
| 8819933 | Method for forming a current distribution structure | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2014-09-02 |
| 8809182 | Pad cushion structure and method of fabrication for Pb-free C4 integrated circuit chip joining | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2014-08-19 |
| 8803317 | Structures for improving current carrying capability of interconnects and methods of fabricating the same | Charles L. Arvin, Raschid J. Bezama, Harry D. Cox, Krystyna W. Semkow, Timothy D. Sullivan | 2014-08-12 |
| 8796133 | Optimization metallization for prevention of dielectric cracking under controlled collapse chip connections | Griselda Bonilla, Mark C. H. Lamorey, Howard S. Landis, Xiao Hu Liu, David L. Questad +2 more | 2014-08-05 |
| 8786059 | Passivation layer surface topography modifications for improved integrity in packaged assemblies | Alexandre Blander, Jon A. Casey, Ian D. Melville, Jennifer V. Muncy, Marie-Claude Paquet | 2014-07-22 |
| 8778792 | Solder bump connections | Jeffrey P. Gambino, Ekta Misra, Christopher D. Muzzy, Wolfgang Sauter, George J. Scott | 2014-07-15 |
| 8766439 | Integrated circuit chip with pyramid or cone-shaped conductive pads for flexible C4 connections and a method of forming the integrated circuit chip | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2014-07-01 |
| 8765593 | Controlled collapse chip connection (C4) structure and methods of forming | Stephen P. Ayotte, David John Hill, Glen E. Richard, Timothy M. Sullivan | 2014-07-01 |
| 8742594 | Structure and method of making an offset-trench crackstop that forms an air gap adjacent to a passivated metal crackstop | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2014-06-03 |
| 8710656 | Redistribution layer (RDL) with variable offset bumps | Brian M. Erwin, Jeffrey P. Gambino, Wolfgang Sauter, George J. Scott | 2014-04-29 |
| 8680689 | Coplanar waveguide for stacked multi-chip systems | Hanyi Ding, Wolfgang Sauter, Guoan Wang, Wayne H. Woods, Jr. | 2014-03-25 |
| 8680675 | Structures and methods for improving solder bump connections in semiconductor devices | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2014-03-25 |
| 8674506 | Structures and methods to reduce maximum current density in a solder ball | Raschid J. Bezama, Gary LaFontant, Ian D. Melville, Ekta Misra, George J. Scott +6 more | 2014-03-18 |
| 8669660 | Solder interconnect pads with current spreading layers | Timothy D. Sullivan | 2014-03-11 |
| 8650512 | Elastic modulus mapping of an integrated circuit chip in a chip/device package | Mark C. H. Lamorey, Xiao Hu Liu, Thomas M. Shaw, Thomas A. Wassick | 2014-02-11 |