GW

Guoan Wang

IBM: 32 patents #3,111 of 70,183Top 5%
UC University Of South Carolina: 5 patents #54 of 728Top 8%
BC Beijing Boe Sensor Technology Co.: 1 patents #134 of 200Top 70%
GR Georgia Tech Research: 1 patents #1,150 of 2,755Top 45%
NG Ngimat: 1 patents #21 of 54Top 40%
BO BOE: 1 patents #7,844 of 12,373Top 65%
Overall (All Time): #82,293 of 4,157,543Top 2%
39
Patents All Time

Issued Patents All Time

Showing 25 most recent of 39 patents

Patent #TitleCo-InventorsDate
11744006 Method and design of high-performance interconnects with improved signal integrity Jinqun Ge 2023-08-29
11626654 Heat dissipating antenna structures Jinqun Ge, Sanjib Sur, Srihari Nelakuditi 2023-04-11
11594797 Dually electrically tunable 3-D compact RF phase shifter Tengxing Wang 2023-02-28
11568671 Fingerprint recognition detection circuit and control method thereof, fingerprint recognition control chip Binbin Liu, Chen Meng, Wei Shi, Wenjie Zhong, Zhong Hu +5 more 2023-01-31
11394125 Reconfigurable antenna design for centimeter-wave and millimeter-wave Sanjib Sur, Srihari Nelakuditi 2022-07-19
10832989 3D-microstrip branchline coupler Barbara S. DeWitt, Essam Mina, B M Farid Rahman 2020-11-10
10586752 3D-microstrip branchline coupler Barbara S. DeWitt, Essam Mina, B M Farid Rahman 2020-03-10
10037931 3D-microstrip branchline coupler Barbara S. DeWitt, Essam Mina, B M Farid Rahman 2018-07-31
9780429 3D-microstrip branchline coupler Barbara S. DeWitt, Essam Mina, B M Farid Rahman 2017-10-03
9553348 On-chip vertical three dimensional microstrip line with characteristic impedance tuning technique and design structures Barbara S. DeWitt, Essam Mina, BM Farid Rahman 2017-01-24
9362606 On-chip vertical three dimensional microstrip line with characteristic impedance tuning technique and design structures Barbara S. DeWitt, Essam Mina, B M Farid Rahman 2016-06-07
9054157 High performance on-chip vertical coaxial cable, method of manufacture and design structure Essam Mina, Wayne H. Woods, Jr. 2015-06-09
9035719 Three dimensional branchline coupler using through silicon vias and design structures Barbara S. DeWitt, Essam Mina, BM Farid Rahman, Wayne H. Woods, Jr. 2015-05-19
8963657 On-chip slow-wave through-silicon via coplanar waveguide structures, method of manufacture and design structure Essam Mina, Wayne H. Woods, Jr. 2015-02-24
8930871 Methodology on developing metal fill as library device Essam Mina 2015-01-06
8898605 On-chip tunable transmission lines, methods of manufacture and design structures Hanyi Ding, Wayne H. Woods, Jr. 2014-11-25
8791771 Reconfigurable Wilkinson power divider and design structure thereof Hanyi Ding, Wayne H. Woods, Jr., Jiansheng Xu 2014-07-29
8766748 Microstrip line structures with alternating wide and narrow portions having different thicknesses relative to ground, method of manufacture and design structures Essam Mina, Wayne H. Woods, Jr. 2014-07-01
8766747 Coplanar waveguide structures with alternating wide and narrow portions, method of manufacture and design structure Essam Mina 2014-07-01
8760245 Coplanar waveguide structures with alternating wide and narrow portions having different thicknesses, method of manufacture and design structure Essam Mina, Wayne H. Woods, Jr. 2014-06-24
8680689 Coplanar waveguide for stacked multi-chip systems Timothy H. Daubenspeck, Hanyi Ding, Wolfgang Sauter, Wayne H. Woods, Jr. 2014-03-25
8643191 On-chip radial cavity power divider/combiner Hanyi Ding, Pinping Sun, Wayne H. Woods, Jr. 2014-02-04
8640076 Methodology on developing metal fill as library device and design structure Essam Mina 2014-01-28
8629536 High performance on-chip vertical coaxial cable, method of manufacture and design structure Essam Mina, Wayne H. Woods, Jr. 2014-01-14
8413098 T-connections, methodology for designing T-connections, and compact modeling of T-connections Hanyi Ding, Essam Mina, Wayne H. Woods, Jr. 2013-04-02