TH

Timothy S. Hayes

IBM: 6 patents #16,453 of 70,183Top 25%
Overall (All Time): #851,191 of 4,157,543Top 25%
6
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
8927411 System and method for forming an aluminum fuse for compatibility with copper BEOL interconnect scheme Felix P. Anderson, Timothy H. Daubenspeck, Jeffrey P. Gambino, Donald R. Letourneau, Thomas L. McDevitt +1 more 2015-01-06
8921975 System and method for forming aluminum fuse for compatibility with copper BEOL interconnect scheme Felix P. Anderson, Timothy H. Daubenspeck, Jeffrey P. Gambino, Donald R. Letourneau, Thomas L. McDevitt +1 more 2014-12-30
6980937 Method and system for quantifying the step profile characteristics semiconductor features using surface analysis data 2005-12-27
6864189 Methodology for measuring and controlling film thickness profiles Michael C. Triplett 2005-03-08
6774019 Incorporation of an impurity into a thin film Charles Choate, Michael Lunn, Paul Nisson, Dean W. Siegel, Michael C. Triplett 2004-08-10
6724947 Method and system for measuring characteristics of curved features 2004-04-20