WB

William E. Bernier

IBM: 29 patents #3,528 of 70,183Top 6%
SF SUNY Research Foundation: 5 patents #430 of 1,231Top 35%
LE Leidos: 1 patents #84 of 151Top 60%
SA Saint-Gobain Abrasifs: 1 patents #184 of 340Top 55%
SA Saint-Gobain Abrasives: 1 patents #204 of 367Top 60%
📍 Endwell, NY: #4 of 267 inventorsTop 2%
🗺 New York: #3,219 of 115,490 inventorsTop 3%
Overall (All Time): #97,520 of 4,157,543Top 3%
35
Patents All Time

Issued Patents All Time

Showing 26–35 of 35 patents

Patent #TitleCo-InventorsDate
6331119 Conductive adhesive having a palladium matrix interface between two metal surfaces Edward G. Bundga 2001-12-18
6288559 Semiconductor testing using electrically conductive adhesives Michael A. Gaynes, Wayne J. Howell, Mark V. Pierson, Ajit K. Trivedi, Charles G. Woychik 2001-09-11
6268739 Method and device for semiconductor testing using electrically conductive adhesives Michael A. Gaynes, Wayne J. Howell, Mark V. Pierson, Ajit K. Trivedi, Charles G. Woychik 2001-07-31
6255208 Selective wafer-level testing and burn-in Claude L. Bertin, Anilkumar C. Bhatt, Michael A. Gaynes, Erik L. Hedberg, Nikhil M. Murdeshwar +5 more 2001-07-03
6251707 Attaching heat sinks directly to flip chips and ceramic chip carriers Michael A. Gaynes, Irving Memis, Hussain Shaukatuallah 2001-06-26
6069023 Attaching heat sinks directly to flip chips and ceramic chip carriers Michael A. Gaynes, Irving Memis, Hussain Shaukatuallah 2000-05-30
5847929 Attaching heat sinks directly to flip chips and ceramic chip carriers Michael A. Gaynes, Irving Memis, Hussain Shaukatuallah 1998-12-08
4453171 Reduced electrode wear in electrolytic printing by pH control of the print reaction zone Charles R. Pigos, Jr. 1984-06-05
4444626 Electrochromic printing Francis Emmi, Edmond O. Fey, Paul Gendler, Robert J. Twieg 1984-04-24
4374001 Electrolytic printing 1983-02-15