Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6204074 | Chip design process for wire bond and flip-chip package | Allan Robert Bertolet, Eberhard Gramatzki | 2001-03-20 |
| 5844317 | Consolidated chip design for wire bond and flip-chip package technologies | Allan Robert Bertolet, Eberhard Gramatski | 1998-12-01 |