Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 6204074 | Chip design process for wire bond and flip-chip package | Allan Robert Bertolet, Eberhard Gramatzki | 2001-03-20 | $35,881,000 |
| 5844317 | Consolidated chip design for wire bond and flip-chip package technologies | Allan Robert Bertolet, Eberhard Gramatski | 1998-12-01 | $29,316,000 |