Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7851911 | Semiconductor chip used in flip chip process | Charles F. Carey, Ashwani K. Malhotra, David L. Questad, Wolfgang Sauter | 2010-12-14 |
| 7674637 | Monitoring cool-down stress in a flip chip process using monitor solder bump structures | Charles F. Carey, Ashwani K. Malhotra, David L. Questad, Wolfgang Sauter | 2010-03-09 |