Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11600569 | Integrated circuit device and method of manufacturing the same | Su Hyun BARK, Sang-Hoon Ahn, Young Bae Kim, Woo Jin Lee, Hoon Seok Seo +1 more | 2023-03-07 |
| 11049810 | Integrated circuit device and method of manufacturing the same | Su Hyun BARK, Sang-Hoon Ahn, Young Bae Kim, Woo Jin Lee, Hoon Seok Seo +1 more | 2021-06-29 |
| 10916437 | Methods of forming micropatterns and substrate processing apparatus | Sang Shin Jang, Jong-Min Baek, Hoon Seok Seo, Eui Bok Lee, Sung-Jin Kang +4 more | 2021-02-09 |
| 10847454 | Semiconductor devices | Eui Bok Lee, Deok-Young Jung, Sang-Bom Kang, Doo-Hwan Park, Jong-Min Baek +2 more | 2020-11-24 |
| 10535600 | Semiconductor device | Hoon Seok Seo, Jong-Min Baek, Su Hyun BARK, Sang-Hoon Ahn, Eui Bok Lee | 2020-01-14 |
| 10510658 | Semiconductor devices | Eui Bok Lee, Deok-Young Jung, Sang-Bom Kang, Doo-Hwan Park, Jong-Min Baek +2 more | 2019-12-17 |
| 10497649 | Integrated circuit device and method of manufacturing the same | Su Hyun BARK, Sang-Hoon Ahn, Young Bae Kim, Woo Jin Lee, Hoon Seok Seo +1 more | 2019-12-03 |
| 10475739 | Semiconductor device | Woo Kyung You, Eui Bok Lee, Jong-Min Baek, Su Hyun BARK, Jang Ho Lee +1 more | 2019-11-12 |
| 10461027 | Semiconductor device including via plug and method of forming the same | Eui Bok Lee, Jong-Min Baek, Sang-Hoon Ahn | 2019-10-29 |
| 10276505 | Integrated circuit device and method of manufacturing the same | Young Bae Kim, Sang-Hoon Ahn, Eui Bok Lee, Su Hyun BARK, Woo Jin Lee +2 more | 2019-04-30 |
| 10229876 | Wiring structures and semiconductor devices | Jun Jung Kim, Young Bae Kim, Jong Sam Kim, Jin-Hyeung Park, Jeong Hoon Ahn +3 more | 2019-03-12 |
| 8373273 | Methods of forming integrated circuit devices having damascene interconnects therein with metal diffusion barrier layers and devices formed thereby | Woo Jin Jang, Bum Ki Moon, Ji-Hong Choi, Minseok Oh, Tien-Jen Cheng | 2013-02-12 |
| 8232200 | Methods of forming integrated circuit devices having damascene interconnects therein with metal diffusion barrier layers and devices formed thereby | Woo Jin Jang, Bum Ki Moon, Ji-Hong Choi, Minseok Oh, Tien-Jen Cheng | 2012-07-31 |
| 8026166 | Interconnect structures comprising capping layers with low dielectric constants and methods of making the same | Griselda Bonilla, Tien-Jen Cheng, Lawrence A. Clevenger, Stephan Grunow, Chao-Kun Hu +5 more | 2011-09-27 |
| 7534720 | Methods of fabricating semiconductor device having slope at lower sides of interconnection hole with etch-stop layer | Ki Ho Kang, Jung Woo Lee, Dae Keun Park | 2009-05-19 |
| 7176126 | Method of fabricating dual damascene interconnection | Ju-hyuck Chung, Il-Goo Kim | 2007-02-13 |
| 7163890 | Methods of fabricating semiconductor device having slope at lower sides of interconnection hole with etch-stop layer | Ki Ho Kang, Jung Woo Lee, Dae Keun Park | 2007-01-16 |