Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8373273 | Methods of forming integrated circuit devices having damascene interconnects therein with metal diffusion barrier layers and devices formed thereby | Hyeok-Sang Oh, Woo Jin Jang, Bum Ki Moon, Minseok Oh, Tien-Jen Cheng | 2013-02-12 |
| 8232200 | Methods of forming integrated circuit devices having damascene interconnects therein with metal diffusion barrier layers and devices formed thereby | Hyeok-Sang Oh, Woo Jin Jang, Bum Ki Moon, Minseok Oh, Tien-Jen Cheng | 2012-07-31 |