Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5831810 | Electronic component package with decoupling capacitors completely within die receiving cavity of substrate | Kenneth A. Bird, Peter J. Brofman, Jason L. Frankel, Suresh D. Kadakia, Sarah H. Knickerbocker +1 more | 1998-11-03 |
| 5147084 | Interconnection structure and test method | John R. Behun, Anson J. Call, Marie Cole, Karl G. Hoebener, Bruno T. Klingel +1 more | 1992-09-15 |
| 5060844 | Interconnection structure and test method | John R. Behun, Anson J. Call, Marie Cole, Karl G. Hoebener, Bruno T. Klingel +1 more | 1991-10-29 |