Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5825629 | Print circuit board product with stencil controlled fine pitch solder formation for fine and coarse pitch component attachment | Karl G. Hoebener, Julian Partridge | 1998-10-20 |
| 5762259 | Method for forming bumps on a substrate | Karl G. Hoebener | 1998-06-09 |
| 5554940 | Bumped semiconductor device and method for probing the same | — | 1996-09-10 |
| 5536677 | Method of forming conductive bumps on a semiconductor device using a double mask structure | — | 1996-07-16 |
| 5492266 | Fine pitch solder deposits on printed circuit board process and product | Karl G. Hoebener, Julian Partridge | 1996-02-20 |