| 5515462 |
Optical interconnect in optical packages using holograms |
Kung-Shiuh Huang |
1996-05-07 |
| 5434524 |
Method of clocking integrated circuit chips |
David T. Shen |
1995-07-18 |
| 5430567 |
Method of clocking integrated circuit chips |
David T. Shen |
1995-07-04 |
| 5337475 |
Process for producing ceramic circuit structures having conductive vias |
Farid Youssif Aoude, Emanuel I. Cooper, Peter Richard Duncombe, Shaji Farooq, Edward A. Giess +12 more |
1994-08-16 |
| 5317657 |
Extrusion of polymer waveguides onto surfaces |
Antonio R. Gallo, James J. McDonough, Gordon J. Robbins |
1994-05-31 |
| 5283104 |
Via paste compositions and use thereof to form conductive vias in circuitized ceramic substrates |
Farid Youssif Aoude, Emanuel I. Cooper, Peter Richard Duncombe, Shaji Farooq, Edward A. Giess +12 more |
1994-02-01 |
| 5208879 |
Optical signal distribution system |
Antonio R. Gallo, Gordon J. Robbins |
1993-05-04 |
| 5170245 |
Semiconductor device having metallic interconnects formed by grit blasting |
Jungihl Kim, Joseph C. Logue, John J. Ritsko, George F. Walker |
1992-12-08 |
| 4896464 |
Formation of metallic interconnects by grit blasting |
Jungihl Kim, Joseph C. Logue, John J. Ritsko, George F. Walker |
1990-01-30 |
| 4673315 |
Apparatus for raising and supporting a building |
Steven D. Gregory |
1987-06-16 |
| 4519851 |
Method for providing pinhole free dielectric layers |
Charles H. Perry |
1985-05-28 |
