EY

Edward K. Yung

MC Mcnc: 5 patents #16 of 66Top 25%
CK City University Of Hong Kong: 1 patents #370 of 1,010Top 40%
Overall (All Time): #859,814 of 4,157,543Top 25%
6
Patents All Time

Issued Patents All Time

Showing 1–6 of 6 patents

Patent #TitleCo-InventorsDate
8410982 Unidirectional antenna comprising a dipole and a loop Pak Wai Chan, Hang Wong 2013-04-02
5381946 Method of forming differing volume solder bumps Nicholas G. Koopman, Glenn Rinne, Iwona Turlik 1995-01-17
5374893 Apparatus for testing, burn-in, and/or programming of integrated circuit chips, and for placing solder bumps thereon Nicholas G. Koopman, Glenn Rinne, Iwona Turlik 1994-12-20
5293006 Solder bump including circular lip 1994-03-08
5289631 Method for testing, burn-in, and/or programming of integrated circuit chips Nicholas G. Koopman, Glenn Rinne, Iwona Turlik 1994-03-01
5162257 Solder bump fabrication method 1992-11-10