| 10734346 |
Method of manufacturing chip-on-chip structure comprising sinterted pillars |
Richard S. Graf, Jay F. Leonard, Charles H. Wilson |
2020-08-04 |
| 10340241 |
Chip-on-chip structure and methods of manufacture |
Richard S. Graf, Jay F. Leonard, Charles H. Wilson |
2019-07-02 |
| 9818653 |
Semiconductor TSV device package to which other semiconductor device package can be later attached |
Richard S. Graf |
2017-11-14 |
| 9754911 |
IC structure with angled interconnect elements |
Charles H. Wilson, Richard S. Graf |
2017-09-05 |
| 9721852 |
Semiconductor TSV device package to which other semiconductor device package can be later attached |
Richard S. Graf |
2017-08-01 |
| 9570422 |
Semiconductor TSV device package for circuit board connection |
Richard S. Graf |
2017-02-14 |
| 9508690 |
Semiconductor TSV device package for circuit board connection |
Richard S. Graf |
2016-11-29 |
| 9484239 |
Sacrificial carrier dicing of semiconductor wafers |
Richard S. Graf, Douglas O. Powell, David J. Russell |
2016-11-01 |
| 9478453 |
Sacrificial carrier dicing of semiconductor wafers |
Richard S. Graf, Douglas O. Powell, David J. Russell |
2016-10-25 |
| 9433105 |
Method of fabricating printed circuit boards |
Richard S. Graf, Thomas E. Lombardi, Sudipta K. Ray |
2016-08-30 |
| 9368425 |
Embedded heat spreader with electrical properties |
Richard S. Graf, Jay F. Leonard, Charles H. Wilson |
2016-06-14 |
| 8530345 |
Electrical contact alignment posts |
David J. Russell |
2013-09-10 |
| 8452475 |
Systems and methods for dynamic aircraft maintenance scheduling |
Mark Johnson |
2013-05-28 |
| 8415792 |
Electrical contact alignment posts |
David J. Russell |
2013-04-09 |
| 8304290 |
Overcoming laminate warpage and misalignment in flip-chip packages |
Richard S. Graf, Thomas E. Lombardi, Sudipta K. Ray |
2012-11-06 |
