Issued Patents All Time
Showing 26–33 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7068138 | High Q factor integrated circuit inductor | Daniel C. Edelstein, Panayotis Andricacos, John M. Cotte, Hariklia Deligianni, Kevin S. Petrarca +2 more | 2006-06-27 |
| 6819000 | High density area array solder microjoining interconnect structure and fabrication method | Kevin S. Petrarca, Sampath Purushothaman, Carlos J. Sambucetti, Richard P. Volant, George F. Walker | 2004-11-16 |
| 6774482 | Chip cooling | Evan G. Colgan, Robert L. Wisnieff, Jeffrey A. Zitz | 2004-08-10 |
| 6747472 | Temporary device attach structure for test and burn in of microjoint interconnects and method for fabricating the same | Samuel McKnight, Kevin S. Petrarca, Sampath Purushothaman, Carlos J. Sambucetti, Joseph J. Van Horn +2 more | 2004-06-08 |
| 6732908 | High density raised stud microjoining system and methods of fabricating the same | Bruce K. Furman, Maheswaran Surendra, Sherif A. Goma, Simon Karecki, Kevin S. Petrarca +4 more | 2004-05-11 |
| 6661098 | High density area array solder microjoining interconnect structure and fabrication method | Kevin S. Petrarca, Sampath Purushothaman, Carlos J. Sambucetti, Richard P. Volant, George F. Walker | 2003-12-09 |
| 6657291 | Combined resistor-capacitor elements for decoupling in electronic packages | Albert E. Ruehli | 2003-12-02 |
| 6593644 | System of a package fabricated on a semiconductor or dielectric wafer with wiring on one face, vias extending through the wafer, and external connections on the opposing face | George Liang-Tai Chiu | 2003-07-15 |