| 10782749 |
Compute assembly for high speed ultra dense compute blades |
Wendell Lengefeld, Abhishek C. Mehta, William M. Megarity, Benjamin Colin Heshmat |
2020-09-22 |
$10,299,000 |
| 10345875 |
Hybrid passive and active cooling assembly |
Jason A. Matteson, Aparna Vallury |
2019-07-09 |
|
| 10264712 |
Harvesting facility water for pumping secondary fluid flow |
Jason A. Matteson |
2019-04-16 |
|
| 10237243 |
File filter |
Christopher J. Hardee, Jason A. Matteson |
2019-03-19 |
$3,213,000 |
| 10045463 |
Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader |
Timothy J. Chainer, David P. Graybill, Madhusudan K. Iyengar, Vinod Kamath, Bejoy J. Kochuparambil +1 more |
2018-08-07 |
$1,950,000 |
| 10043020 |
File filter |
Christopher J. Hardee, Jason A. Matteson |
2018-08-07 |
$1,950,000 |
| 9943936 |
Overmolded dual in-line memory module cooling structure |
Michael A. Boraas, Vinod Kamath, Michael S. Miller, Jamil A. Wakil |
2018-04-17 |
|
| 9936607 |
Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader |
Timothy J. Chainer, David P. Graybill, Madhusudan K. Iyengar, Vinod Kamath, Bejoy J. Kochuparambil +1 more |
2018-04-03 |
$2,801,000 |
| 9930806 |
Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component |
Timothy J. Chainer, David P. Graybill, Madhusudan K. Iyengar, Vinod Kamath, Bejoy J. Kochuparambil +1 more |
2018-03-27 |
$2,459,000 |
| 9930807 |
Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader |
Timothy J. Chainer, David P. Graybill, Madhusudan K. Iyengar, Vinod Kamath, Bejoy J. Kochuparambil +1 more |
2018-03-27 |
$2,459,000 |
| 9875951 |
Heat sink with orientable fins |
Troy W. Glover, Chunjian Ni, Whitcomb R. Scott, III |
2018-01-23 |
|
| 9877416 |
Heat management in a server rack |
Brian M. Kerrigan, Jason A. Matteson, Edward J. McNulty |
2018-01-23 |
|
| 9696235 |
Managing water leakage from a water cooling system within a compute node |
Shareef F. Alshinnawi, Gary D. Cudak, Edward S. Suffern, J. Mark Weber |
2017-07-04 |
|
| 9668382 |
Coolant distribution unit for a multi-node chassis |
Derek I. Schmidt, Jason A. Matteson, Vinod Kamath |
2017-05-30 |
|
| 9574597 |
Fastening device |
Jason A. Matteson, Aparna Vallury |
2017-02-21 |
|
| 9414523 |
Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component |
Timothy J. Chainer, David P. Graybill, Madhusudan K. Iyengar, Vinod Kamath, Bejoy J. Kochuparambil +1 more |
2016-08-09 |
$4,722,000 |
| 9342118 |
Liquid cooling of multiple components on a circuit board |
Richard M. Barina, Derek I. Schmidt, James S. Womble |
2016-05-17 |
$3,602,000 |
| 9310859 |
Liquid cooling of multiple components on a circuit board |
Richard M. Barina, Derek I. Schmidt, James S. Womble |
2016-04-12 |
$2,843,000 |
| 9307674 |
Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component |
Timothy J. Chainer, David P. Graybill, Madhusudan K. Iyengar, Vinod Kamath, Bejoy J. Kochuparambil +1 more |
2016-04-05 |
$4,230,000 |
| 9185830 |
Thermoelectric-enhanced, liquid-based cooling of a multi-component electronic system |
Timothy J. Chainer, David P. Graybill, Madhusudan K. Iyengar, Vinod Kamath, Bejoy J. Kochuparambil +1 more |
2015-11-10 |
$5,091,000 |
| 9132519 |
Directly connected heat exchanger tube section and coolant-cooled structure |
Timothy J. Chainer, Patrick A. Coico, David P. Graybill, Madhusudan K. Iyengar, Vinod Kamath +2 more |
2015-09-15 |
$3,796,000 |
| 9027360 |
Thermoelectric-enhanced, liquid-based cooling of a multi-component electronic system |
Timothy J. Chainer, David P. Graybill, Madhusudan K. Iyengar, Vinod Kamath, Bejoy J. Kochuparambil +1 more |
2015-05-12 |
$6,873,000 |
| 8913384 |
Thermal transfer structures coupling electronics card(s) to coolant-cooled structure(s) |
Milnes P. David, David P. Graybill, Madhusudan K. Iyengar, Vinod Kamath, Bejoy J. Kochuparambil +2 more |
2014-12-16 |
$3,695,000 |
| 8900503 |
Method of forming an overmolded dual in-line memory module cooling structure |
Michael A. Boraas, Vinod Kamath, Michael S. Miller, Jamil A. Wakil |
2014-12-02 |
$2,384,000 |
| 8807204 |
Electrohydrodynamic airflow across a heat sink using a non-planar ion emitter array |
Michael S. June, Chunjian Ni, Dana S. Royer |
2014-08-19 |
$3,895,000 |
