Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Thermoelectric-enhanced, liquid-based cooling of a multi-component electronic system

Thermoelectric-enhanced, liquid-based cooling of a multi-component electronic system

US Patent 9185830 · Granted Nov 10, 2015

Estimated economic value: $5,091,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Modular liquid cooling architecture for liquid cooling2025
Cooling systems having a conduit and a heat transfer device for transferring hea2025
Continuous feed liquid coolant replacement2025
Spring loaded compliant coolant distribution manifold for direct liquid cooled m2025
Integrated circuit with a ring-shaped hot spot area and multidirectional cooling2025
Heterogeneous integrated multi-chip cooler module2025
Direct liquid cooling with O-ring sealing2025
Cooling systems having cooling and augmentation loops for electronic components 2025
Methods and heat distribution devices for thermal management of chip assemblies2025
Modular liquid cooling architecture for liquid cooling2024
High-capacity memory air cooling device2024
Overcooling an edge device that uses electrical energy from a local renewable en2024