Issued Patents All Time
Showing 51–75 of 85 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837333 | Electronic package cover having underside rib | Krishna R. Tunga | 2017-12-05 |
| 9735083 | Adjustable heat sink fin spacing | Paul F. Bodenweber | 2017-08-15 |
| 9721870 | Cooling structure for electronic boards | Paul F. Bodenweber, Kenneth C. Marston, Hilton T. Toy, Randall J. Werner, Jeffrey A. Zitz | 2017-08-01 |
| 9437515 | Heat spreading layer with high thermal conductivity | Evan G. Colgan, Taryn J. Davis, Chenzhou Lian, Yi Pan, Jeffrey A. Zitz | 2016-09-06 |
| 9401315 | Thermal hot spot cooling for semiconductor devices | Paul F. Bodenweber, Taryn J. Davis, Marcus E. Interrante, Chenzhou Lian, Kenneth C. Marston +2 more | 2016-07-26 |
| 9366591 | Determining magnitude of compressive loading | Paul F. Bodenweber, Virendra R. Jadhav, Steven P. Ostrander, Jiantao Zheng, Jeffrey A. Zitz | 2016-06-14 |
| 9226426 | Electronic device console with natural draft cooling | Paul F. Bodenweber, Jon A. Casey, Chenzhou Lian, Kathryn C. Rivera | 2015-12-29 |
| 9087834 | Multichip electronic packages and methods of manufacture | Suresh D. Kadakia, Hilton T. Toy, Jeffrey A. Zitz | 2015-07-21 |
| 9089052 | Multichip module with stiffening frame and associated covers | Shidong Li, Gregg B. Monjeau, Hilton T. Toy, Thomas Weiss | 2015-07-21 |
| 9089051 | Multichip module with stiffening frame and associated covers | Shidong Li, Gregg B. Monjeau, Hilton T. Toy, Thomas Weiss | 2015-07-21 |
| 8906809 | Multichip electronic packages and methods of manufacture | Martin Beaumier, Steven P. Ostrander, Hilton T. Toy, Jeffrey A. Zitz | 2014-12-09 |
| 8900927 | Multichip electronic packages and methods of manufacture | Martin Beaumier, Steven P. Ostrander, Hilton T. Toy, Jeffrey A. Zitz | 2014-12-02 |
| 8860206 | Multichip electronic packages and methods of manufacture | Hilton T. Toy, Krishna R. Tunga, Jeffrey A. Zitz | 2014-10-14 |
| 8794079 | Determining magnitude of compressive loading | Paul F. Bodenweber, Virendra R. Jadhav, Steven P. Ostrander, Jiantao Zheng, Jeffrey A. Zitz | 2014-08-05 |
| 8717043 | Determining thermal interface material (TIM) thickness change | Paul F. Bodenweber, Virendra R. Jadhav, Jiantao Zheng, Jeffrey A. Zitz | 2014-05-06 |
| 8592970 | Multichip electronic packages and methods of manufacture | Hilton T. Toy, Krishna R. Tunga, Jeffrey A. Zitz | 2013-11-26 |
| 8587114 | Multichip electronic packages and methods of manufacture | Suresh D. Kadakia, Hilton T. Toy, Jeffrey A. Zitz | 2013-11-19 |
| 8445331 | Multichip electronic packages and methods of manufacture | Suresh D. Kadakia, Hilton T. Toy, Jeffrey A. Zitz | 2013-05-21 |
| 8299608 | Enhanced thermal management of 3-D stacked die packaging | Gerald K. Bartley, David R. Motschman, Jamil A. Wakil, Xiaojin Wei, Jiantao Zheng | 2012-10-30 |
| 8232636 | Reliability enhancement of metal thermal interface | James N. Humenik, Sushumna Iruvanti, Richard Langlois, Hsichang Liu, Govindarajan Natarajan +4 more | 2012-07-31 |
| 8037594 | Method of forming a flip-chip package | Jeffrey T. Coffin, Michael A. Gaynes, David L. Questad, Hilton T. Toy, Jamil A. Wakil | 2011-10-18 |
| 7992627 | Microjet module assembly | Raschid J. Bezama, Govindarajan Natarajan, Hilton T. Toy | 2011-08-09 |
| 7928562 | Segmentation of a die stack for 3D packaging thermal management | Amilcar R. Arvelo, Evan G. Colgan, John Harold Magerlein, Kenneth C. Marston, Kathryn C. Rivera +3 more | 2011-04-19 |
| 7875972 | Semiconductor device assembly having a stress-relieving buffer layer | Virendra R. Jadhav, Jiantao Zheng | 2011-01-25 |
| 7812438 | Via offsetting to reduce stress under the first level interconnect (FLI) in microelectronics packaging | Virendra R. Jadhav, David L. Questad, Xiaojin Wei, Jiantao Zheng | 2010-10-12 |