Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11129832 | Biheteroaryl compounds and uses thereof | Anthony Estrada, Liting Dong, Kevin X. Chen, Paul Gibbons, Malcolm Huestis +7 more | 2021-09-28 |
| 10256180 | Package structure and manufacturing method of package structure | Wei-Jen Lai | 2019-04-09 |
| 10134668 | Package structure | Wei-Jen Lai | 2018-11-20 |
| 10090256 | Semiconductor structure | Wei-Jen Lai | 2018-10-02 |
| 10028942 | 3-substituted pyrazoles and uses thereof | Anthony Estrada, Snahel Patel, Michael Siu | 2018-07-24 |
| 10010549 | Biheteroaryl compounds and uses thereof | Anthony Estrada, Liting Dong, Kevin X. Chen, Paul Gibbons, Malcolm Huestis +7 more | 2018-07-03 |
| 9859193 | Package structure | Wei-Jen Lai | 2018-01-02 |
| 9801282 | Package structure | — | 2017-10-24 |
| 9688965 | Recombinant neuraminidase and uses thereof | Suh-Chin Wu, Chia-Ying Lin | 2017-06-27 |
| 9644008 | Deglycosylated hemagglutinin and manufacture thereof | Suh-Chin Wu, Yun-Ju Huang | 2017-05-09 |
| 9550777 | 3-substituted pyrazoles and use as DLK inhibitors | Anthony Estrada, Snahel Patel, Michael Siu | 2017-01-24 |
| 9508634 | Package structure | — | 2016-11-29 |
| 9451694 | Package substrate structure | Chih-Kung Huang, Wei-Jen Lai | 2016-09-20 |
| 9365583 | Substituted pyrazoles and uses thereof | Michael Siu, Anthony Estrada, Joseph P. Lyssikatos, Snahel Patel, Guibai Liang +1 more | 2016-06-14 |
| 6762118 | Package having array of metal pegs linked by printed circuit lines | Chien-Hung Lai | 2004-07-13 |
| 6486564 | Heat dissipation module for a BGA IC | Yi Pan, Kuo-Yuan Lee | 2002-11-26 |
| 6459162 | Encapsulated semiconductor die package | Yung-Chao Jen, Ming-Feng Wu | 2002-10-01 |
| 6380062 | Method of fabricating semiconductor package having metal peg leads and connected by trace lines | — | 2002-04-30 |
| 6278182 | Lead frame type semiconductor package | Chien-Hung Lai | 2001-08-21 |
| 6262475 | Lead frame with heat slug | Chih-Kung Huang | 2001-07-17 |
| 6204553 | Lead frame structure | Hui Liu, Jung-Jie Liou, Yi Pan, Sheng-Tung Tsai | 2001-03-20 |
| 6078099 | Lead frame structure for preventing the warping of semiconductor package body | Jung-Jie Liou, Chih-Kung Huang | 2000-06-20 |