JB

Jin-Chyuan Biar

AT Apack Technologies: 1 patents #5 of 9Top 60%
UC United Test Center: 1 patents #3 of 8Top 40%
Overall (All Time): #1,569,549 of 4,157,543Top 40%
3
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
7737452 Light-emitting element package and light source apparatus using the same Chih-Kung Huang, Jue Huang 2010-06-15
6221689 Method for improving the reliability of underfill process for a chip Chong-Ren Maa, Albert Lin 2001-04-24
6190943 Chip scale packaging method Cheng-Hui Lee, Kuo-Teh Ho, Chong-Ren Maa 2001-02-20