Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7080447 | Method of manufacturing solder mask of printed circuit board | Wan-Kuo Chih, Ming-Sung Tsai | 2006-07-25 |
| 6933448 | Printed circuit board having permanent solder mask | Wan-Kuo Chih, Ming-Sung Tsai | 2005-08-23 |
| 6753480 | Printed circuit board having permanent solder mask | Wan-Kuo Chih, Ming-Sung Tsai | 2004-06-22 |
| 6458514 | Process for forming through holes in substrate of printed circuit board | Hong-Ming Lin, Toshikazu Oda, Makoto Nakamura, Sunao Meguro | 2002-10-01 |
| 6395625 | Method for manufacturing solder mask of printed circuit board | Wan-Kuo Chih, Ming-Sung Tsai | 2002-05-28 |
| 6258622 | Flip clip bonding leadframe-type packaging method for integrated circuit device and a device formed by the packaging method | Albert Lin, Sam Chiang | 2001-07-10 |
| 6221689 | Method for improving the reliability of underfill process for a chip | Albert Lin, Jin-Chyuan Biar | 2001-04-24 |
| 6190943 | Chip scale packaging method | Cheng-Hui Lee, Kuo-Teh Ho, Jin-Chyuan Biar | 2001-02-20 |