Sam Chiang — 1 Patent at Apack Technologies

Sam Chiang has been granted 1 US patent while listed as an inventor at Apack Technologies. All of these patents were granted in 2001. Sam Chiang ranks #2,406,284 of 4,157,543 US inventors in our database (top 57.9%). Patent records list Sam Chiang in Baoshan, TW.

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Showing 1–1 of 1 patents

Patent #	Title	Co-Inventors	Date
6258622	Flip clip bonding leadframe-type packaging method for integrated circuit device and a device formed by the packaging method	Albert Lin, Chong-Ren Maa	2001-07-10

Sam Chiang — 1 Patent

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