Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6258622 | Flip clip bonding leadframe-type packaging method for integrated circuit device and a device formed by the packaging method | Albert Lin, Chong-Ren Maa | 2001-07-10 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6258622 | Flip clip bonding leadframe-type packaging method for integrated circuit device and a device formed by the packaging method | Albert Lin, Chong-Ren Maa | 2001-07-10 |