Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8371079 | Reinforced mull post assembly | Pao Yu An, Tong Mingyong | 2013-02-12 |
| 6258622 | Flip clip bonding leadframe-type packaging method for integrated circuit device and a device formed by the packaging method | Sam Chiang, Chong-Ren Maa | 2001-07-10 |
| 6221689 | Method for improving the reliability of underfill process for a chip | Chong-Ren Maa, Jin-Chyuan Biar | 2001-04-24 |
| 6048775 | Method to make shallow trench isolation structure by HDP-CVD and chemical mechanical polish processes | Liang-Gi Yao, Stanley Hsu, Randy (C. H.) Chang | 2000-04-11 |
| 4676847 | Controlled boron doping of silicon | — | 1987-06-30 |
| 4604150 | Controlled boron doping of silicon | — | 1986-08-05 |
| 4581222 | Membrane immune assay | John D. Baldeschwieler, Ronald C. Gamble, George W. Tin | 1986-04-08 |