Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Flip clip bonding leadframe-type packaging method for integrated circuit device and a device formed by the packaging method

Flip clip bonding leadframe-type packaging method for integrated circuit device and a device formed by the packaging method

US Patent 6258622 · Granted Jul 10, 2001

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Reinforced mull post assembly2013
Method of manufacturing solder mask of printed circuit board2006
Printed circuit board having permanent solder mask2005
Printed circuit board having permanent solder mask2004
Process for forming through holes in substrate of printed circuit board2002
Method for manufacturing solder mask of printed circuit board2002
Method for improving the reliability of underfill process for a chip2001
Method for improving the reliability of underfill process for a chip2001
Chip scale packaging method2001
Method to make shallow trench isolation structure by HDP-CVD and chemical mechan2000
Controlled boron doping of silicon1987
Controlled boron doping of silicon1986