Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D784297 | Earphone | — | 2017-04-18 |
| 6614660 | Thermally enhanced IC chip package | Jin-Chyung Bai, Weiheng Shan | 2003-09-02 |
| 6190943 | Chip scale packaging method | Kuo-Teh Ho, Chong-Ren Maa, Jin-Chyuan Biar | 2001-02-20 |