Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6614660 | Thermally enhanced IC chip package | Jin-Chyung Bai, Cheng-Hui Lee | 2003-09-02 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6614660 | Thermally enhanced IC chip package | Jin-Chyung Bai, Cheng-Hui Lee | 2003-09-02 |