TO

Toshikazu Oda

GC Goo Chemical Co.: 4 patents #7 of 39Top 20%
EK Emaus Kyoto: 4 patents #2 of 14Top 15%
AN Anritsu: 2 patents #192 of 633Top 35%
KT Kabushiki Kaisha Toshiba: 2 patents #9,982 of 21,451Top 50%
KU Kyoto University: 2 patents #286 of 1,688Top 20%
SO Sony: 1 patents #17,262 of 25,231Top 70%
MC Mitsubishi Chemical: 1 patents #1,511 of 3,022Top 50%
MC Murata Manufacturing Co.: 1 patents #3,462 of 5,295Top 70%
NI Ngk Insulators: 1 patents #1,271 of 2,083Top 65%
EN Entech: 1 patents #8 of 15Top 55%
NK Nitto Kagaku Kogyo Kabushiki Kaisha: 1 patents #15 of 43Top 35%
Overall (All Time): #248,005 of 4,157,543Top 6%
18
Patents All Time

Issued Patents All Time

Showing 1–18 of 18 patents

Patent #TitleCo-InventorsDate
12418733 Imaging apparatus and electronic device Tomohiko Shibata, Yuki Ozawa 2025-09-16
11772983 Titania porous body and method for producing same Kazunari Yamada, Hideki Shimizu, Norio Ishizuka, Kyoko Konishi 2023-10-03
11613618 Porous body, and method for producing porous body Norio Ishizuka 2023-03-28
10858491 Porous particle made of organic polymer, method for producing porous particle made of organic polymer, and block copolymer Norio Ishizuka, Kyoko Konishi, Yoshinobu Tsujii, Keita Sakakibara, Takaya Sato 2020-12-08
10773241 Separating medium and column for liquid chromatography Norio Ishizuka, Kyoko Konishi, Yoshinobu Tsujii, Keita Sakakibara, Shoya Yoda 2020-09-15
8174422 Power-supply-noise cancelling circuit and solid-state imaging device Ryuta Okamoto 2012-05-08
7431533 Floating levee sheet 2008-10-07
6900752 Stepwise zero-data-detection mute circuit Mitsuru Nagata, Hiroyuki Eguchi 2005-05-31
6458514 Process for forming through holes in substrate of printed circuit board Chong-Ren Maa, Hong-Ming Lin, Makoto Nakamura, Sunao Meguro 2002-10-01
6315927 Photosensitive conductive paste Masahiro Kubota, Michiaki Iha, Shizuharu Watanbe, Satoshi Miyayama 2001-11-13
6136506 Ultraviolet-curable and alkali-developing type photo solder resist ink Soichi Hashimoto, Koichi Yoshioka, Masahiro Mizushima 2000-10-24
5916736 Process of manufacturing a printed circuit board with plated landless through-holes by the use of a filling material Katsuo Doi, Satoshi Miyayama 1999-06-29
5821031 Photosensitive solder resist ink, printed circuit board and production thereof Soichi Hashimoto, Fumito Suzuki 1998-10-13
5821279 Filling material composition used for a process of manufacturing a printed circuit board with plated through-holes Katsuo Doi, Satoshi Miyayama 1998-10-13
5539064 Resist ink composition, printed circuit board produced by using the composition and process for producing the printed circuit board Soichi Hashimoto, Satoshi Miyayama, Toshiaki Nishimura 1996-07-23
5025237 Relay device for switching radio frequency signal Syoji Yamazaki, Kenji Iwanaga, Yoshitaka Gono 1991-06-18
4857677 Dial device Tomeo Tanaka 1989-08-15
4317759 Stabilized aqueous solutions of acrylamide polymers Shoichi Kanda, Yasunosuke Tanabe, Takeshi Arai 1982-03-02