Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12368092 | Package substrate insulation opening design | Shyue-Ter Leu | 2025-07-22 |
| 12107038 | Semiconductor packages | Fu-Jen Li | 2024-10-01 |
| 11817382 | Package substrate insulation opening design | Shyue-Ter Leu | 2023-11-14 |
| 11600562 | Semiconductor packages and method of manufacturing the same | Fu-Jen Li | 2023-03-07 |
| 11251114 | Package substrate insulation opening design | Shyue-Ter Leu | 2022-02-15 |
| 7521266 | Production and packaging control for repaired integrated circuits | Chi Chang Su, Chien-Wu Chu, You-Wen Yau, Long-Sheng Yeou | 2009-04-21 |
| 6957116 | Quality assurance system and method | Jung-Yi Tsai, Chao Yu Chang, Chui-Chung Chiu | 2005-10-18 |