Issued Patents All Time
Showing 1–25 of 76 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12423521 | Using unsupervised clustering and language model to normalize attribute tuples of items in a database | Prithvishankar Srinivasan, Saurav Manchanda, Shishir Kumar Prasad, Min Xie | 2025-09-23 |
| 12424576 | Integrated circuit package and method | Wen-Chih Chiou, Chen-Hua Yu, Szu-Wei Lu | 2025-09-23 |
| 12400878 | Integrated circuit package and method | Szu-Wei Lu, Kuo-Chiang Ting, Shang-Yun Hou, Chi-Hsi Wu, Weiming Chris Chen | 2025-08-26 |
| 12315806 | Electronic device and manufacturing method thereof | Tsung-Fu Tsai, Hou-Ju Huang, Szu-Wei Lu, Hung-Wei Tsai | 2025-05-27 |
| 12292455 | Chip socket, testing fixture and chip testing method thereof | — | 2025-05-06 |
| 12210591 | Weakly supervised extraction of attributes from unstructured data to generate training data for machine learning models | Jonathan Newman, Min Xie, Haixun Wang | 2025-01-28 |
| 12176874 | Signal receiving circuit and noise filtering method thereof | — | 2024-12-24 |
| 12165978 | Package structure and method of manufacturing the same | Szu-Wei Lu | 2024-12-10 |
| 12142579 | Package structure and manufacturing method thereof | Tsung-Fu Tsai, Szu-Wei Lu, Chen-Hsuan Tsai, I-Ting Huang | 2024-11-12 |
| 12051652 | Package structure and method of fabricating the same | Chi-Hsi Wu, Chen-Hua Yu, Szu-Wei Lu | 2024-07-30 |
| 12020952 | Method of fabricating semiconductor device having dummy micro bumps between stacking dies | Tsung-Fu Tsai, Chen-Hsuan Tsai, Chung Chieh TING, Szu-Wei Lu | 2024-06-25 |
| 12009022 | Semiconductor device for memory device | — | 2024-06-11 |
| 11959939 | Chip socket, testing fixture and chip testing method thereof | — | 2024-04-16 |
| 11948896 | Package structure | Tsung-Fu Tsai, Kung-Chen Yeh, I-Ting Huang, Szu-Wei Lu | 2024-04-02 |
| 11942750 | Laser inspection system | Yi-Chi Lee, Hsin-Chia Su, Yu-Cheng Song, Fu-Shun Ho, Chih-Chun Chen | 2024-03-26 |
| 11817425 | Package structure with underfill | Chen-Hsuan Tsai, Tsung-Fu Tsai, Szu-Wei Lu | 2023-11-14 |
| 11817410 | Integrated circuit package and method | Wen-Chih Chiou, Chen-Hua Yu, Szu-Wei Lu | 2023-11-14 |
| 11769739 | Package structure and manufacturing method thereof | Tsung-Fu Tsai, Szu-Wei Lu, Chen-Hsuan Tsai, I-Ting Huang | 2023-09-26 |
| 11670593 | Package-on-package (POP) electronic device and manufacturing method thereof | Tsung-Fu Tsai, Hou-Ju Huang, Szu-Wei Lu, Hung-Wei Tsai | 2023-06-06 |
| 11574872 | Package structure and method of manufacturing the same | Szu-Wei Lu | 2023-02-07 |
| 11543312 | Spindle shaft device with torque sensor | Chien-Nan Yeh, Pei-Yu Chang, Chao-Ta Huang | 2023-01-03 |
| 11476205 | Package structure and method for forming the same | Tsung-Fu Tsai, Kung-Chen Yeh, I-Ting Huang, Szu-Wei Lu | 2022-10-18 |
| 11469197 | Integrated circuit package and method | Wen-Chih Chiou, Chen-Hua Yu, Szu-Wei Lu | 2022-10-11 |
| 11462418 | Integrated circuit package and method | Szu-Wei Lu, Weiming Chris Chen, Kuo-Chiang Ting, Shang-Yun Hou, Chi-Hsi Wu | 2022-10-04 |
| 11417606 | Package structure and method of fabricating the same | Chi-Hsi Wu, Chen-Hua Yu, Szu-Wei Lu | 2022-08-16 |