Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412841 | Semiconductor package and manufacturing method thereof | Chin-Chuan Chang, Szu-Wei Lu, Tsung-Fu Tsai | 2025-09-09 |
| 12272568 | Semiconductor package and manufacturing method thereof | Jiun-Ting Chen, Chih-Wei Wu, Szu-Wei Lu, Tsung-Fu Tsai, Ying-Ching Shih +1 more | 2025-04-08 |
| 12142579 | Package structure and manufacturing method thereof | Tsung-Fu Tsai, Shih-Ting Lin, Szu-Wei Lu, I-Ting Huang | 2024-11-12 |
| 12020952 | Method of fabricating semiconductor device having dummy micro bumps between stacking dies | Tsung-Fu Tsai, Chung Chieh TING, Shih-Ting Lin, Szu-Wei Lu | 2024-06-25 |
| 11990351 | Semiconductor package and manufacturing method thereof | Jiun-Ting Chen, Chih-Wei Wu, Szu-Wei Lu, Tsung-Fu Tsai, Ying-Ching Shih +1 more | 2024-05-21 |
| 11854984 | Semiconductor package and manufacturing method thereof | Chin-Chuan Chang, Szu-Wei Lu, Tsung-Fu Tsai | 2023-12-26 |
| 11817425 | Package structure with underfill | Tsung-Fu Tsai, Shih-Ting Lin, Szu-Wei Lu | 2023-11-14 |
| 11769739 | Package structure and manufacturing method thereof | Tsung-Fu Tsai, Shih-Ting Lin, Szu-Wei Lu, I-Ting Huang | 2023-09-26 |
| 11355454 | Package structure and manufacturing method thereof | Tsung-Fu Tsai, Shih-Ting Lin, Szu-Wei Lu, I-Ting Huang | 2022-06-07 |
| 11101145 | Semiconductor device with dummy micro bumps between stacking dies to improve flowability of underfill material | Tsung-Fu Tsai, Chung Chieh TING, Shih-Ting Lin, Szu-Wei Lu | 2021-08-24 |
| 10985140 | Structure and formation method of package structure with underfill | Tsung-Fu Tsai, Shih-Ting Lin, Szu-Wei Lu | 2021-04-20 |
| 10157888 | Integrated fan-out packages and methods of forming the same | Jing-Cheng Lin, Tsung-Fu Tsai, Chen-Hua Yu, Po-Hao Tsai, Shih-Ting Lin +2 more | 2018-12-18 |