Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12217999 | Trench isolation process | Chung-Lei Chen, Cheng-Hsin Chen, Che-Yi Lin, Clark Lee | 2025-02-04 |
| 12020952 | Method of fabricating semiconductor device having dummy micro bumps between stacking dies | Tsung-Fu Tsai, Chen-Hsuan Tsai, Shih-Ting Lin, Szu-Wei Lu | 2024-06-25 |
| 11443976 | Trench isolation process | Chung-Lei Chen, Cheng-Hsin Chen, Che-Yi Lin, Clark Lee | 2022-09-13 |
| 11101145 | Semiconductor device with dummy micro bumps between stacking dies to improve flowability of underfill material | Tsung-Fu Tsai, Chen-Hsuan Tsai, Shih-Ting Lin, Szu-Wei Lu | 2021-08-24 |