Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515288 | Protective layer for contact pads in fan-out interconnect structure and method of forming same | Chin-Chuan Chang, Jing-Cheng Lin | 2022-11-29 |
| 10748869 | Protective layer for contact pads in fan-out interconnect structure and method of forming same | Chin-Chuan Chang, Jing-Cheng Lin | 2020-08-18 |
| 10636748 | Package structure | Chen-Hua Yu, Jing-Cheng Lin | 2020-04-28 |
| 10224293 | Package structure and method for forming the same | Chen-Hua Yu, Jing-Cheng Lin | 2019-03-05 |
| 10083913 | Fan-out POP structure with inconsecutive polymer layer | Yi-Lin Tsai, Jeffrey Chang, Jing-Cheng Lin, Nai-Wei Liu | 2018-09-25 |
| 9941244 | Protective layer for contact pads in fan-out interconnect structure and method of forming same | Chin-Chuan Chang, Jing-Cheng Lin | 2018-04-10 |
| 9847269 | Fan-out packages and methods of forming same | Jing-Cheng Lin, Jeffrey Chang, Chun-Hsing Su, Yi-Chao Mao | 2017-12-19 |
| 9741693 | Semiconductor package and method of forming the same | Chin-Fu Kao, Jing-Cheng Lin | 2017-08-22 |
| 9633924 | Package structure and method for forming the same | Chen-Hua Yu, Jing-Cheng Lin | 2017-04-25 |
| 9461018 | Fan-out PoP structure with inconsecutive polymer layer | Yi-Lin Tsai, Jeffrey Chang, Jing-Cheng Lin, Nai-Wei Liu | 2016-10-04 |
| 9358660 | Grinding wheel design with elongated teeth arrangement | Chun-Hsing Su, Jing-Cheng Lin, Wen-Hua Chang, Yi-Chao Mao | 2016-06-07 |