Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12151140 | Techniques for providing customized exercise-related recommendations | Robert Pitchford, Stephen Holter | 2024-11-26 |
| 11754779 | Electronic devices with coherent fiber bundles | Chih-Yao Chang, Chun-Chih Chang, Nathan K. Gupta, Wei Lin, Xiani Li | 2023-09-12 |
| 11637086 | Sawing underfill in packaging processes | Szu-Wei Lu, Li-Chung Kuo, Jing-Cheng Lin | 2023-04-25 |
| 11631654 | Sawing underfill in packaging processes | Szu-Wei Lu, Li-Chung Kuo, Jing-Cheng Lin | 2023-04-18 |
| 11340725 | Load cell array for detection of force input to an electronic device enclosure | Andrew Deng, Travis N. Owens, Shubhaditya Majumdar, Wei Lin, Timothy Koch +1 more | 2022-05-24 |
| 10840215 | Sawing underfill in packaging processes | Szu-Wei Lu, Li-Chung Kuo, Jing-Cheng Lin | 2020-11-17 |
| 10814170 | Techniques for providing customized exercise-related recommendations | Robert Pitchford, Stephen Holter | 2020-10-27 |
| 10782818 | Load cell array for detection of force input to an electronic device enclosure | Andrew Deng, Travis N. Owens, Shubhaditya Majumdar, Wei Lin, Timothy Koch +1 more | 2020-09-22 |
| 10157879 | Die-to-die gap control for semiconductor structure and method | Jing-Cheng Lin, Szu-Wei Lu, Ying-Ching Shih, Li-Chung Kuo, Long Hua Lee +2 more | 2018-12-18 |
| 9620430 | Sawing underfill in packaging processes | Szu-Wei Lu, Li-Chung Kuo, Jing-Cheng Lin | 2017-04-11 |
| 8963334 | Die-to-die gap control for semiconductor structure and method | Jing-Cheng Lin, Szu-Wei Lu, Ying-Ching Shih, Li-Chung Kuo, Long Hua Lee +2 more | 2015-02-24 |
| 8828848 | Die structure and method of fabrication thereof | Jing-Cheng Lin, Li-Chung Kuo, Szu-Wei Lu | 2014-09-09 |